Plasma activation and self bonding of peek for the use in the encapsulation of medical implants

Firas Awaja, Shengnan Zhang, Natalie James, David R. McKenzie

Research output: Contribution to a Journal (Peer & Non Peer)Articlepeer-review

22 Citations (Scopus)

Abstract

Polyether ether ketone (PEEK) and its composites have emerged as one of the main candidate materials for replacing titanium and its alloys for the encapsulating components of medical implants. PEEK, however, is a difficult material to bond without the use of adhesion promoting agents. Experiments based on the central composite rotatable design (CCRD) were used to find an optimum plasma surface modification treatment. X-ray photoelectron spectrometry (XPS), contact angle measurements and scanning electron microscopy (SEM) were used to provide surface molecular and thermodynamic information. Higher self bond strength of PEEK was found to correlate with higher relative oxygen concentration and total surface energy. Mechanisms for the autohesive bond formation were developed based on the oxidation of the surface. Polyether ether ketone (PEEK), which is one of the main candidate materials for replacing titanium for the encapsulation of medical implants components, requires surface activation in order to bond without the use of adhesion promoting agents. Experiments based on the central composite rotatable design were used to define an optimum plasma surface modification treatment. Bond strength correlates with surface oxygen concentration, and with surface energy.

Original languageEnglish
Pages (from-to)866-875
Number of pages10
JournalPlasma Processes and Polymers
Volume7
Issue number9-10
DOIs
Publication statusPublished - 14 Oct 2010
Externally publishedYes

Keywords

  • medical implants
  • PEEK
  • plasma treatments
  • self bonding
  • X-ray photoelectron spectroscopy (XPS)

Fingerprint

Dive into the research topics of 'Plasma activation and self bonding of peek for the use in the encapsulation of medical implants'. Together they form a unique fingerprint.

Cite this