Abstract
Molecular or direct bonding is an emerging technique to assemble directly two silicon wafers or metal parts. In vaccum, the two surfaces are free to bond perfectly if their lattice orientation is coincident. When defects have to be considered like a misorientation or when bonding is processed in air, a slowdown of the bonding velocity is observed and its efficiency in term of adhesion energy decreased. The aim of this project is to gain insight in the bonding process and to investigate the influence of the bonding characteristics. A specific strategy based on a non linear contact mechanics scheme is adopted to describe the bonding process: the methodology is shown to provide enough flexibility to account for the normal and tangential interactions. These latter are described with Traction-Opening displacement laws that are first derived from interactomic potential. the influence on the bonding characteristic on the bonding wavefront is investigated to attempt deriving local information of the bonding mechanism.
| Original language | English |
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| Pages | 4737-4742 |
| Number of pages | 6 |
| Publication status | Published - 2013 |
| Event | 13th International Conference on Fracture 2013, ICF 2013 - Beijing, China Duration: 16 Jun 2013 → 21 Jun 2013 |
Conference
| Conference | 13th International Conference on Fracture 2013, ICF 2013 |
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| Country/Territory | China |
| City | Beijing |
| Period | 16/06/13 → 21/06/13 |
Keywords
- Cohesive model
- Finite element simulation
- Molecular bonding