Laser soldering of surface mount components and memory chips

T. J. Glynn; A. Flanagan; A. Conneely; G. Lowe

Laser soldering of surface mount components and memory chips

T. J. Glynn, A. Flanagan, A. Conneely, G. Lowe

Physics

University of Galway

Research output: Chapter in Book or Conference Publication/Proceeding › Conference Publication › peer-review

Abstract

Laser soldering has advantages of localized heating and small focused spot size which make it an attractive technique for bonding temperature sensitive surface mount device (SMD) with small lead pitch onto a printed wiring board (PWB). Using a Nd:YAG laser, we have application - a quad ceramic chip with 224 leads (with 0.025″ lead spacing) and 16-pin memory chips (with 0.020″ spacing). Laser soldering was used to bond the components, without solder paste, onto appropriate pre-tinned substrates. Thermal modelling of the process was carried out, using a commercial finite element package. Miniature thermocouples were also used to verify model predictions by measuring the temperature profiles in real time. The laser bonder will be incorporated into a robot-controlled station with an intelligent vision system for component placement/inspection.

Original language	English
Title of host publication	Proceedings of SPIE - The International Society for Optical Engineering
Editors	Dave Farson, William Steen, Isamu Miyamoto
Publisher	Publ by Society of Photo-Optical Instrumentation Engineers
Pages	405-414
Number of pages	10
ISBN (Print)	0912035498
Publication status	Published - 1993
Event	ICALEO Laser Materials Processing - Orlando, FL, USA Duration: 25 Oct 1992 → 29 Oct 1992

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	1990
ISSN (Print)	0277-786X

Conference

Conference	ICALEO Laser Materials Processing
City	Orlando, FL, USA
Period	25/10/92 → 29/10/92

Cite this

Glynn, T. J., Flanagan, A., Conneely, A., & Lowe, G. (1993). Laser soldering of surface mount components and memory chips. In D. Farson, W. Steen, & I. Miyamoto (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (pp. 405-414). (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 1990). Publ by Society of Photo-Optical Instrumentation Engineers.

Glynn, T. J. ; Flanagan, A. ; Conneely, A. et al. / Laser soldering of surface mount components and memory chips. Proceedings of SPIE - The International Society for Optical Engineering. editor / Dave Farson ; William Steen ; Isamu Miyamoto. Publ by Society of Photo-Optical Instrumentation Engineers, 1993. pp. 405-414 (Proceedings of SPIE - The International Society for Optical Engineering).

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title = "Laser soldering of surface mount components and memory chips",

abstract = "Laser soldering has advantages of localized heating and small focused spot size which make it an attractive technique for bonding temperature sensitive surface mount device (SMD) with small lead pitch onto a printed wiring board (PWB). Using a Nd:YAG laser, we have application - a quad ceramic chip with 224 leads (with 0.025″ lead spacing) and 16-pin memory chips (with 0.020″ spacing). Laser soldering was used to bond the components, without solder paste, onto appropriate pre-tinned substrates. Thermal modelling of the process was carried out, using a commercial finite element package. Miniature thermocouples were also used to verify model predictions by measuring the temperature profiles in real time. The laser bonder will be incorporated into a robot-controlled station with an intelligent vision system for component placement/inspection.",

author = "Glynn, \{T. J.\} and A. Flanagan and A. Conneely and G. Lowe",

year = "1993",

language = "English",

isbn = "0912035498",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

publisher = "Publ by Society of Photo-Optical Instrumentation Engineers",

pages = "405--414",

editor = "Dave Farson and William Steen and Isamu Miyamoto",

booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",

note = "ICALEO Laser Materials Processing ; Conference date: 25-10-1992 Through 29-10-1992",

}

Glynn, TJ, Flanagan, A, Conneely, A & Lowe, G 1993, Laser soldering of surface mount components and memory chips. in D Farson, W Steen & I Miyamoto (eds), Proceedings of SPIE - The International Society for Optical Engineering. Proceedings of SPIE - The International Society for Optical Engineering, vol. 1990, Publ by Society of Photo-Optical Instrumentation Engineers, pp. 405-414, ICALEO Laser Materials Processing, Orlando, FL, USA, 25/10/92.

Laser soldering of surface mount components and memory chips. / Glynn, T. J.; Flanagan, A.; Conneely, A. et al.
Proceedings of SPIE - The International Society for Optical Engineering. ed. / Dave Farson; William Steen; Isamu Miyamoto. Publ by Society of Photo-Optical Instrumentation Engineers, 1993. p. 405-414 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 1990).

Research output: Chapter in Book or Conference Publication/Proceeding › Conference Publication › peer-review

TY - GEN

T1 - Laser soldering of surface mount components and memory chips

AU - Glynn, T. J.

AU - Flanagan, A.

AU - Conneely, A.

AU - Lowe, G.

PY - 1993

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N2 - Laser soldering has advantages of localized heating and small focused spot size which make it an attractive technique for bonding temperature sensitive surface mount device (SMD) with small lead pitch onto a printed wiring board (PWB). Using a Nd:YAG laser, we have application - a quad ceramic chip with 224 leads (with 0.025″ lead spacing) and 16-pin memory chips (with 0.020″ spacing). Laser soldering was used to bond the components, without solder paste, onto appropriate pre-tinned substrates. Thermal modelling of the process was carried out, using a commercial finite element package. Miniature thermocouples were also used to verify model predictions by measuring the temperature profiles in real time. The laser bonder will be incorporated into a robot-controlled station with an intelligent vision system for component placement/inspection.

AB - Laser soldering has advantages of localized heating and small focused spot size which make it an attractive technique for bonding temperature sensitive surface mount device (SMD) with small lead pitch onto a printed wiring board (PWB). Using a Nd:YAG laser, we have application - a quad ceramic chip with 224 leads (with 0.025″ lead spacing) and 16-pin memory chips (with 0.020″ spacing). Laser soldering was used to bond the components, without solder paste, onto appropriate pre-tinned substrates. Thermal modelling of the process was carried out, using a commercial finite element package. Miniature thermocouples were also used to verify model predictions by measuring the temperature profiles in real time. The laser bonder will be incorporated into a robot-controlled station with an intelligent vision system for component placement/inspection.

UR - https://www.scopus.com/pages/publications/0027835855

M3 - Conference Publication

AN - SCOPUS:0027835855

SN - 0912035498

T3 - Proceedings of SPIE - The International Society for Optical Engineering

SP - 405

EP - 414

BT - Proceedings of SPIE - The International Society for Optical Engineering

A2 - Farson, Dave

A2 - Steen, William

A2 - Miyamoto, Isamu

PB - Publ by Society of Photo-Optical Instrumentation Engineers

T2 - ICALEO Laser Materials Processing

Y2 - 25 October 1992 through 29 October 1992

ER -

Glynn TJ, Flanagan A, Conneely A, Lowe G. Laser soldering of surface mount components and memory chips. In Farson D, Steen W, Miyamoto I, editors, Proceedings of SPIE - The International Society for Optical Engineering. Publ by Society of Photo-Optical Instrumentation Engineers. 1993. p. 405-414. (Proceedings of SPIE - The International Society for Optical Engineering).

Laser soldering of surface mount components and memory chips

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