Integrated passives in advanced printed wiring boards

S. O'Reilly; M. Duffy; T. O'Donnell; P. McCloskey; S. C. Ó Mathúna

doi:10.1108/03056120110398218

Integrated passives in advanced printed wiring boards

S. O'Reilly, M. Duffy, T. O'Donnell, P. McCloskey, S. C. Ó Mathúna

Tyndall National Institute

Research output: Contribution to a Journal (Peer & Non Peer) › Article › peer-review

8 Citations (Scopus)

Abstract

This paper will focus on the work which was carried out under the Brite-EuRAM funded project, COMPRISE (BE 96-3371), the objective of which was to develop new materials and manufacturing processes to embed passive components (resistors, inductors, capacitors) within printed wiring structures fabricated from laminate materials. For the realisation of integrated resistors, a commercially available planar resistor material is incorporated in different test structures. The technology consists of a copper foll of standard thickness on which a resistive layer is deposited by means of electroless plating. For the realisation of capacitors in multi-layered PCB structures, significant progress was made in the development and fabrication of very thin laminates. Higher dielectric constants of these laminate materials enable the increase of the capacitance per unit area. For inductors, both aircore (no magnetic material) and magnetic core components have been investigated.

Original language	English
Pages (from-to)	22-25
Number of pages	4
Journal	Circuit World
Volume	27
Issue number	4
DOIs	https://doi.org/10.1108/03056120110398218
Publication status	Published - 2001
Externally published	Yes

Keywords

Components
Integrated circuits
Printed circuit boards

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1108/03056120110398218

Cite this

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title = "Integrated passives in advanced printed wiring boards",

abstract = "This paper will focus on the work which was carried out under the Brite-EuRAM funded project, COMPRISE (BE 96-3371), the objective of which was to develop new materials and manufacturing processes to embed passive components (resistors, inductors, capacitors) within printed wiring structures fabricated from laminate materials. For the realisation of integrated resistors, a commercially available planar resistor material is incorporated in different test structures. The technology consists of a copper foll of standard thickness on which a resistive layer is deposited by means of electroless plating. For the realisation of capacitors in multi-layered PCB structures, significant progress was made in the development and fabrication of very thin laminates. Higher dielectric constants of these laminate materials enable the increase of the capacitance per unit area. For inductors, both aircore (no magnetic material) and magnetic core components have been investigated.",

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author = "S. O'Reilly and M. Duffy and T. O'Donnell and P. McCloskey and \{{\'O} Math{\'u}na\}, \{S. C.\}",

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doi = "10.1108/03056120110398218",

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TY - JOUR

T1 - Integrated passives in advanced printed wiring boards

AU - O'Reilly, S.

AU - Duffy, M.

AU - O'Donnell, T.

AU - McCloskey, P.

AU - Ó Mathúna, S. C.

PY - 2001

Y1 - 2001

N2 - This paper will focus on the work which was carried out under the Brite-EuRAM funded project, COMPRISE (BE 96-3371), the objective of which was to develop new materials and manufacturing processes to embed passive components (resistors, inductors, capacitors) within printed wiring structures fabricated from laminate materials. For the realisation of integrated resistors, a commercially available planar resistor material is incorporated in different test structures. The technology consists of a copper foll of standard thickness on which a resistive layer is deposited by means of electroless plating. For the realisation of capacitors in multi-layered PCB structures, significant progress was made in the development and fabrication of very thin laminates. Higher dielectric constants of these laminate materials enable the increase of the capacitance per unit area. For inductors, both aircore (no magnetic material) and magnetic core components have been investigated.

AB - This paper will focus on the work which was carried out under the Brite-EuRAM funded project, COMPRISE (BE 96-3371), the objective of which was to develop new materials and manufacturing processes to embed passive components (resistors, inductors, capacitors) within printed wiring structures fabricated from laminate materials. For the realisation of integrated resistors, a commercially available planar resistor material is incorporated in different test structures. The technology consists of a copper foll of standard thickness on which a resistive layer is deposited by means of electroless plating. For the realisation of capacitors in multi-layered PCB structures, significant progress was made in the development and fabrication of very thin laminates. Higher dielectric constants of these laminate materials enable the increase of the capacitance per unit area. For inductors, both aircore (no magnetic material) and magnetic core components have been investigated.

KW - Components

KW - Integrated circuits

KW - Printed circuit boards

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U2 - 10.1108/03056120110398218

DO - 10.1108/03056120110398218

M3 - Article

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SN - 0305-6120

VL - 27

SP - 22

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JO - Circuit World

JF - Circuit World

IS - 4

ER -

Integrated passives in advanced printed wiring boards

Abstract

Keywords

UN SDGs

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