Abstract
Alumina derivative ceramics and low temperature co-fired ceramic (LTCC) electronic multichip module (MCM) packaging substrates have been characterized using single- and double-sided inspection laser flash thermal diffusivity measurement techniques. The paper highlights problems associated with both the measurement system and associated data analysis for the single-sided measurement, and these data are evaluated with reference to that measured by an existing (double sided inspection) standard laser flash method. Finally, a preliminary single-sided measurement methodology is proposed.
| Original language | English (Ireland) |
|---|---|
| Title of host publication | A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials |
| Number of pages | 8 |
| Volume | 18 |
| Publication status | Published - 1 Dec 1995 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Authors (Note for portal: view the doc link for the full list of authors)
- Authors
- Kehoe, L,Kelly, PV,OConnor, GM,OReilly, M,Crean, GM
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