TY - GEN
T1 - Electro-mechanical response of a 3D nerve bundle model to mechanical loads leading to axonal injury
AU - Cinelli, I.
AU - Destrade, M.
AU - Duffy, M.
AU - McHugh, P.
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/9/13
Y1 - 2017/9/13
N2 - Axonal damage is one of the most common pathological features of traumatic brain injury, leading to abnormalities in signal propagation for nervous systems. We present a 3D fully coupled electro-mechanical model of a nerve bundle, made with the finite element software Abaqus 6.13-3. The model includes a real-time coupling, modulated threshold for spiking activation and independent alteration of the electrical properties for each 3-layer fibre within the bundle. Compression and tension are simulated to induce damage at the nerve membrane. Changes in strain, stress distribution and neural activity are investigated for myelinated and unmyelinated nerve fibres, by considering the cases of an intact and of a traumatized nerve membrane. Results show greater changes in transmitting action potential in the myelinated fibre.
AB - Axonal damage is one of the most common pathological features of traumatic brain injury, leading to abnormalities in signal propagation for nervous systems. We present a 3D fully coupled electro-mechanical model of a nerve bundle, made with the finite element software Abaqus 6.13-3. The model includes a real-time coupling, modulated threshold for spiking activation and independent alteration of the electrical properties for each 3-layer fibre within the bundle. Compression and tension are simulated to induce damage at the nerve membrane. Changes in strain, stress distribution and neural activity are investigated for myelinated and unmyelinated nerve fibres, by considering the cases of an intact and of a traumatized nerve membrane. Results show greater changes in transmitting action potential in the myelinated fibre.
UR - https://www.scopus.com/pages/publications/85032203931
U2 - 10.1109/EMBC.2017.8036989
DO - 10.1109/EMBC.2017.8036989
M3 - Conference Publication
T3 - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
SP - 978
EP - 981
BT - 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017
Y2 - 11 July 2017 through 15 July 2017
ER -