TY - GEN
T1 - Dynamic control of airflow balance in data centers
AU - Linder, Stephen Paul
AU - Gilder, Jim Van
AU - Zhang, Yan
AU - Barrett, Enda
N1 - Publisher Copyright:
Copyright © 2019 ASME.
PY - 2019
Y1 - 2019
N2 - Efficient cooling of data center infrastructure is an important way to reduce total energy consumption. Containment, with separation of hot and cold airflows has allowed significant increase in efficiencies. However, balancing the airflow, so that IT equipment in an aisle only receives the cooling airflow that that aisle needs is still often not done. We propose a new architecture where IT racks are clustered together with shared hot aisles ducted to a common ceiling plenum. Each aisle has an actively controlled damper used to balance the airflow to the cooling infrastructure. Using a differential air pressure sensor in each aisle and an algorithm designed to balance the flow network, we minimize the cooling airflow and maximize cooling efficiency.
AB - Efficient cooling of data center infrastructure is an important way to reduce total energy consumption. Containment, with separation of hot and cold airflows has allowed significant increase in efficiencies. However, balancing the airflow, so that IT equipment in an aisle only receives the cooling airflow that that aisle needs is still often not done. We propose a new architecture where IT racks are clustered together with shared hot aisles ducted to a common ceiling plenum. Each aisle has an actively controlled damper used to balance the airflow to the cooling infrastructure. Using a differential air pressure sensor in each aisle and an algorithm designed to balance the flow network, we minimize the cooling airflow and maximize cooling efficiency.
KW - Airflow balance
KW - Containment
KW - Data center
KW - Flow networks
KW - Reinforcement learning
UR - http://www.scopus.com/inward/record.url?scp=85084162926&partnerID=8YFLogxK
U2 - 10.1115/IPACK2019-6304
DO - 10.1115/IPACK2019-6304
M3 - Conference Publication
AN - SCOPUS:85084162926
T3 - ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
BT - ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
Y2 - 7 October 2019 through 9 October 2019
ER -
