TY - JOUR
T1 - Autohesion of plasma treated semi-crystalline PEEK
T2 - Comparative study of argon, nitrogen and oxygen treatments
AU - Zhang, Shengnan
AU - Awaja, Firas
AU - James, Natalie
AU - McKenzie, David R.
AU - Ruys, Andrew J.
PY - 2011/1/20
Y1 - 2011/1/20
N2 - Semi-crystalline polyetheretherketone (PEEK) is of interest for providing hermetic sealing of implantable medical devices. Self bonding or autohesion is achieved by mild temperature and pressure treatment and is potentially useful to form joints in the encapsulation of active medical implants. The surfaces of PEEK films were treated in a radio-frequency (RF) plasma containing one of the gases Ar, N2 and O2, to achieve surface activation. The bond strength developed over the interface of PEEK films was evaluated by lap-shear testing. The effects of plasma conditions on the surface morphology, composition, and properties were determined using the profilometer, contact angle measurements, X-ray photoelectron spectrometry (XPS) and scanning electron microscopy (SEM). Results obtained show that plasma treatment of the PEEK films enhances their bonding strength, with the Ar treated films exhibiting the highest bond strength and nitrogen the lowest. Bond strength was shown to correlate positively with total oxygen content, with C-O group concentration and with the polar component of surface energy. Bond strength correlated negatively with CO group concentration.
AB - Semi-crystalline polyetheretherketone (PEEK) is of interest for providing hermetic sealing of implantable medical devices. Self bonding or autohesion is achieved by mild temperature and pressure treatment and is potentially useful to form joints in the encapsulation of active medical implants. The surfaces of PEEK films were treated in a radio-frequency (RF) plasma containing one of the gases Ar, N2 and O2, to achieve surface activation. The bond strength developed over the interface of PEEK films was evaluated by lap-shear testing. The effects of plasma conditions on the surface morphology, composition, and properties were determined using the profilometer, contact angle measurements, X-ray photoelectron spectrometry (XPS) and scanning electron microscopy (SEM). Results obtained show that plasma treatment of the PEEK films enhances their bonding strength, with the Ar treated films exhibiting the highest bond strength and nitrogen the lowest. Bond strength was shown to correlate positively with total oxygen content, with C-O group concentration and with the polar component of surface energy. Bond strength correlated negatively with CO group concentration.
KW - Autohesion
KW - Medical encapsulation
KW - PEEK
KW - Plasma bonding
KW - XPS
UR - http://www.scopus.com/inward/record.url?scp=78650250304&partnerID=8YFLogxK
U2 - 10.1016/j.colsurfa.2010.11.013
DO - 10.1016/j.colsurfa.2010.11.013
M3 - Article
AN - SCOPUS:78650250304
SN - 0927-7757
VL - 374
SP - 88
EP - 95
JO - Colloids and Surfaces A: Physicochemical and Engineering Aspects
JF - Colloids and Surfaces A: Physicochemical and Engineering Aspects
IS - 1-3
ER -