Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

Mohammad Alibakhshikenari; Bal S. Virdee; Chan H. See; Sam Jeffery Fishlock; Navneet Soin; James McLaughlin; Raed A. Abd-Alhameed; Ernesto Limiti

doi:10.1109/APCAP47827.2019.9472184

Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

Mohammad Alibakhshikenari
, Bal S. Virdee
, Chan H. See
, Sam Jeffery Fishlock
, Navneet Soin
, James McLaughlin
, Raed A. Abd-Alhameed
, Ernesto Limiti

Electronics Engineering Department
University of Rome "Tor Vergata"
London Metropolitan University
Edinburgh Napier University
Ulster University
University of Bradford

Research output: Chapter in Book or Conference Publication/Proceeding › Conference Publication › peer-review

2 Citations (Scopus)

Abstract

This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.

Original language	English
Title of host publication	2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	673-674
Number of pages	2
ISBN (Electronic)	9781665400541
DOIs	https://doi.org/10.1109/APCAP47827.2019.9472184
Publication status	Published - 4 Aug 2019
Externally published	Yes
Event	8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019 - Incheon, Korea, Republic of Duration: 4 Aug 2019 → 7 Aug 2019

Publication series

Name	2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

Conference

Conference	8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019
Country/Territory	Korea, Republic of
City	Incheon
Period	4/08/19 → 7/08/19

Keywords

feeding mechanism
high-efficiency
metamaterial
On-chip antenna
silicon
substrate integrated waveguide
terahertz
wideband

Access to Document

10.1109/APCAP47827.2019.9472184

Cite this

Alibakhshikenari, M., Virdee, B. S., See, C. H., Fishlock, S. J., Soin, N., McLaughlin, J., Abd-Alhameed, R. A., & Limiti, E. (2019). Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. In 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019 (pp. 673-674). Article 9472184 (2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APCAP47827.2019.9472184

Alibakhshikenari, Mohammad ; Virdee, Bal S. ; See, Chan H. et al. / Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 673-674 (2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019).

@inproceedings{9ba03a8231774eb893f1cde78607a65d,

title = "Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components",

abstract = "This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1{\texttimes}1{\texttimes}0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5\%, respectively, over a wide frequency range of 0.20-0.22 THz.",

keywords = "feeding mechanism, high-efficiency, metamaterial, On-chip antenna, silicon, substrate integrated waveguide, terahertz, wideband",

author = "Mohammad Alibakhshikenari and Virdee, \{Bal S.\} and See, \{Chan H.\} and Fishlock, \{Sam Jeffery\} and Navneet Soin and James McLaughlin and Abd-Alhameed, \{Raed A.\} and Ernesto Limiti",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019 ; Conference date: 04-08-2019 Through 07-08-2019",

year = "2019",

month = aug,

day = "4",

doi = "10.1109/APCAP47827.2019.9472184",

language = "English",

series = "2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "673--674",

booktitle = "2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019",

}

Alibakhshikenari, M, Virdee, BS, See, CH, Fishlock, SJ, Soin, N, McLaughlin, J, Abd-Alhameed, RA & Limiti, E 2019, Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. in 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019., 9472184, 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 673-674, 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019, Incheon, Korea, Republic of, 4/08/19. https://doi.org/10.1109/APCAP47827.2019.9472184

Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. / Alibakhshikenari, Mohammad; Virdee, Bal S.; See, Chan H. et al.
2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 673-674 9472184 (2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019).

Research output: Chapter in Book or Conference Publication/Proceeding › Conference Publication › peer-review

TY - GEN

T1 - Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

AU - Alibakhshikenari, Mohammad

AU - Virdee, Bal S.

AU - See, Chan H.

AU - Fishlock, Sam Jeffery

AU - Soin, Navneet

AU - McLaughlin, James

AU - Abd-Alhameed, Raed A.

AU - Limiti, Ernesto

PY - 2019/8/4

Y1 - 2019/8/4

N2 - This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.

AB - This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.

KW - feeding mechanism

KW - high-efficiency

KW - metamaterial

KW - On-chip antenna

KW - silicon

KW - substrate integrated waveguide

KW - terahertz

KW - wideband

UR - https://www.scopus.com/pages/publications/85092195025

U2 - 10.1109/APCAP47827.2019.9472184

DO - 10.1109/APCAP47827.2019.9472184

M3 - Conference Publication

AN - SCOPUS:85092195025

T3 - 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

SP - 673

EP - 674

BT - 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

Y2 - 4 August 2019 through 7 August 2019

ER -

Alibakhshikenari M, Virdee BS, See CH, Fishlock SJ, Soin N, McLaughlin J et al. Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. In 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 673-674. 9472184. (2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019). doi: 10.1109/APCAP47827.2019.9472184

Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

Abstract

Publication series

Conference

Keywords

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