2017 8TH INTERNATIONAL IEEE EMBS CONFERENCE ON NEURAL ENGINEERING (NER)

Research output: Chapter in Book or Conference Publication/ProceedingConference Publicationpeer-review

Abstract

Traumatic brain injuries and damage are major causes of death and disability. Whereas recent experimental evidence has uncovered mechanical phenomena accompanying the neural activity, the mechanism by which mechanical impact affects neuronal impairment remains unclear. We propose a 3D model of a nerve bundle to understand the electrophysiological changes due to trauma. Here, the electrical and mechanical phenomena are simulated simultaneously by using electro-thermal equivalences in the finite element software Abaqus CAE 6.13-3. This model provides a unique framework which combines a real-time fully coupled electro-mechanical, modulated threshold for spiking activation and damage as a function of strain and strain rate. Results show the alteration of electrostriction and neural activity due to damage as observed in experiments. One of the key findings is the distribution of residual stresses and strains at the membrane of each fibre due to mechanically-induced electrophysiological impairments.
Original languageEnglish (Ireland)
Title of host publicationNeurotrauma Evaluation in a 3D Electro-Mechanical Model of a Nerve Bundle
Number of pages4
Publication statusPublished - 1 Jan 2017

Authors (Note for portal: view the doc link for the full list of authors)

  • Authors
  • Cinelli, I,Destrade, M,Duffy, M,McHugh, P,

Fingerprint

Dive into the research topics of '2017 8TH INTERNATIONAL IEEE EMBS CONFERENCE ON NEURAL ENGINEERING (NER)'. Together they form a unique fingerprint.

Cite this