Methods and apparatus for cutting a substrate are disclosed. In one arrangement, a plurality of recesses are formed in the surface of the substrate. The recesses as such that a stress can be applied to the substrate that is concentrated by the recesses. The concentrated stress causes the substrate to be cut along a cutting line that passes through the recesses. The cutting occurs via propagation of a crack through the recesses.. Patent Number US10710922B2. U.S.A.